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Description

Wencon Release agent is used in applications where you need to prevent adhesion between the Wencon repair compound, Coating or Putty and the substrate.

Key technical data

Product numberProduct nameIMPA no.ISSA no.
No. 1110Wencon Release Agent, 50 g unit (0,07 lb)81235075.553.60

50 g unit (0,07 lb)

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